Beijing Yuchuang Qiji Technology Development Co., Ltd.

Beijing Yuchuang Qiji Technology Development Co., Ltd.

Manufacturer from China
Verified Supplier
1 Years
Home / Products / Dell Poweredge Server /

3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Contact Now
Beijing Yuchuang Qiji Technology Development Co., Ltd.
Visit Website
Country/Region:china
Contact Person:MrSales
Contact Now

3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Ask Latest Price
Video Channel
Brand Name :D E L L
Model Number :D E L L R750XS
Place of Origin :China
MOQ :1 pieces
Price :Contact us
Payment Terms :L/C, D/A, D/P, T/T, Western Union
Delivery Time :2-7 working days
Certification :OpenManage Systems Management
Supply Ability :/pieces >=2 pieces
Packaging Details :Original packaging box+Based on customer needs
Description :R750XS
Stock :IN Stock
CPU :Intel® Xeon® Scalable Processor 3rd Gen
PSU :UP TO 2*600W-1400W, hot swap redundant
Memory,RAM :• 16 DDR4 DIMM slots,speeds up to 3200 MT/s • Supports registered ECC DDR4 DIMMs only
Drive bays,Hard disk :8 /16x 2.5+2*2.5,12*3.5+2*2.5,SAS/SATA/NVME
PCIE :Up to 5 x PCIe Gen4 slots + 1 x PCIe Gen3 slots • 3 x16 Gen4 low profile • 2 x16 Gen4 low profile (optional) • 1 x8 Gen3 (x4 lane) low profile
RAID,Storage Controller :Internal controllers: PERC H345, PERC H355, PERC H745, PERC H755, PERC H755N, HBA355i
Network :Maximum 1 OCP 3.0
Weight+Dimensions :25-40Kg,4.29 x 43.46 x 61.49 cm
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

The Dell EMC PowerEdge R750xs

with 3rd generation Intel® Xeon® Scalable processors, is purposefully designed with distinctive, customer-defined requirements to deliver enterprise performance for scale-out environments.

3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Specification

Features

Technical Specifications

Processor

Up to two 3rd Generation Intel Xeon Scalable processors with up to 32 cores

Memory

• 16 DDR4 DIMM slots, supports RDIMM 1 TB max, speeds up to 3200 MT/s
• Supports registered ECC DDR4 DIMMs only

Storage controllers

• Internal controllers: PERC H345, PERC H355, PERC H745, PERC H755, PERC H755N, HBA355i, S150
• Internal Boot: Internal Dual SD Module, Boot Optimized Storage Subsystem (BOSS-S2): HWRAID 2 x M.2 SSDs, USB
• External PERC (RAID): PERC H840, HBA355e

Drive Bays

Front bays:
• 0 drive bay
• Up to 8 x 3.5-inch SAS/SATA (HDD/SSD) max 128 TB
• Up to 12 x 3.5-inch SAS/SATA (HDD/SSD) max 192 TB
• Up to 8 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 61.44 TB
• Up to 16 x 2.5-inch SAS/SATA (HDD/SSD) max 122.88 TB
• Up to 16 x 2.5-inch (SAS/SATA) + 8 x 2.5-inch (NVMe) (HDD/SSD) max 184.32 TB
Rear bays:
• Up to 2 x 2.5-inch SAS/SATA/NVMe (HDD/SSD) max 15.36 TB

Power Supplies

• 600W Platinum Mixed Mode (100-240Vac or 240Vdc) hot swap redundant
• 800W Platinum Mixed Mode (100-240Vac or 240Vdc) hot swap redundant
• 1100W Titanium Mixed Mode (100-240Vac or 240Vdc) hot swap redundant
• 1400W Platinum Mixed Mode (100-240Vac or 240Vdc) hot swap redundant
• 1100W -48Vdc hot swap redundant (CAUTION: only works with -48Vdc to -60Vdc power input)

Cooling options

Air cooling

Fans

• Standard fans/High performance Silver fans/High performance Gold fans
• Up to six hot swap fans

Dimensions

• Height – 86.8 mm (3.41 inches)
• Width – 482.0 mm (18.97 inches)
• Depth – 707.78 mm (27.85 inches) – without bezel
721.62 mm (28.4 inches) – with bezel

Form Factor

2U rack server

Embedded Management

• iDRAC9
• iDRAC Service Module
• iDRAC Direct
• Quick Sync 2 wireless module

Bezel

Optional LCD bezel or security bezel

OpenManage Software

• OpenManage Enterprise
• OpenManage Power Manager plugin
• OpenManage SupportAssist plugin
• OpenManage Update Manager plugin

Mobility

OpenManage Mobile

Integrations and Connections

• BMC Truesight
• Microsoft System Center
• OpenManage Integrations
• Red Hat Ansible Modules
• VMware vCenter and vRealize Operations Manager

• IBM Tivoli Netcool/OMNIbus
• IBM Tivoli Network Manager IP Edition
• Micro Focus Operations Manager
• OpenManage Connections
• Nagios Core
• Nagios XI

Security

• Cryptographically signed firmware
• Secure Boot
• Secure Erase
• Silicon Root of Trust
• System Lockdown (requires iDRAC9 Enterprise or Datacenter)
• TPM 1.2/2.0 FIPS, CC-TCG certified, TPM 2.0 China NationZ

Embedded NIC

2 x 1 GbE LOM

 

Network Options

1 x OCP 3.0

 

GPU Options

Not supported

 

Ports

Front Ports
• 1 x iDRAC Direct (Micro-AB USB) port
• 1 x USB 2.0
• 1 x VGA

Rear Ports
• 1 x USB 2.0
• 1 x Serial (optional)
• 1 x USB 3.0
• 2 x Ethernet
• 1 x VGA

Internal Ports
• 1 x USB 3.0 (optional)

PCIe

Up to 5 x PCIe Gen4 slots + 1 x PCIe Gen3 slots
• 3 x16 Gen4 low profile
• 2 x16 Gen4 low profile (optional)
• 1 x8 Gen3 (x4 lane) low profile

Operating System and Hypervisors

• Canonical Ubuntu Server LTS
• Citrix Hypervisor
• Microsoft Windows Server with Hyper-V
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
• VMware ESXi
For specifications and interoperability details, see Dell.com/OSsupport.

Chassis views and features
Front view of the system
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 1. Front view of 24 x 2.5-inch drive system
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 2. Front view of 16 x 2.5-inch drive system
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 3. Front view of 8 x 2.5-inch drive system
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 4. Front view of 12 x 3.5-inch drive system
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 5. Front view of 8 x 3.5-inch drive system
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 6. Front view of 0 drive system

Rear view of the system
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 7. Rear view of the system
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 8. Rear view of the system with riser slot numbering
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 9. Rear view of the 2x 2.5-inch system with Rear HDD + BOSS
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 10. Rear view of the system
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 11. Rear view of the system
3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Figure 12. Rear view of the system

3rd generation Intel Xeon Dell EMC PowerEdge R750xs 16 DDR4 DIMM

Notices:

1. Open the packaging, check the products carefully, and take them gently.

2. The product is a brand new original unopened equipment.

3. All products 1 year warranty, and the buyer is responsible for the return shipping cost.

International Buyers Please Note:
Import duties, taxes, and charges are not included in the item price or shipping cost. These charges are the buyer's responsibility.
Please check with your country's customs office to determine what these additional costs will be prior to bidding or buying.
Customs fees are normally charged by the shipping company or collected when you pick the item up. These fees are not additional shipping charges.
We won't under-value merchandise or mark the item as a gift on customs forms. Doing that is against U.S. and international laws.
Customs delays are not the responsibility of the seller.

Packing & Delivery

Based on customer needs

Company Profile

Beijing Yuchuangqiji Technology Development Co. , Ltd. (hereinafter referred to as"Yuchuangqi Ji") was established in Beijing in 2015. The registered capital of the company is 5 million yuan, covering many domestic and international regions, many manufacturers of advanced technology experience, to provide users with a full range of comprehensive services. The lean practical management core the unique business model has created the lean effective organization and the management organization the modern management idea has become the company efficient movement power, sound management norms and systems become the link between customers, technology and market, market, is the rapid and accurate transmission of information, business and technology an important guarantee of efficient play. In the company's joint efforts and before and after the continuous efforts, the company has achieved very good results. Professional Industry Team, advanced project management and Knowledge Management model, to provide customers with specialized, high-level services. A booming business system from Enterprise Office OA, financial software, ERP systems, to the commonly used virtualization, clustering, CAE simulation (applied in aerospace, automotive, mechanical manufacturing, for university disciplines, such as Beijing University of Aeronautics and Astronautics, Tsinghua University and other important scientific research projects delivery, such as supercomputer cloud computing (with a number of universities, research projects) , life sciences meteorology industry, China Railway Administration, medical: and so on, the company mainly aimed at customer product consulting, architecture design, equipment selection, configuration, production, delivery, implementation planning, integrated testing, data migration, optimization, training and maintenance, etc.

FAQ

Inquiry Cart 0